• Automatic Double Sides Precision Lapping Polishing Machine for Semiconductor Parts
  • Automatic Double Sides Precision Lapping Polishing Machine for Semiconductor Parts
  • Automatic Double Sides Precision Lapping Polishing Machine for Semiconductor Parts
  • Automatic Double Sides Precision Lapping Polishing Machine for Semiconductor Parts
  • Automatic Double Sides Precision Lapping Polishing Machine for Semiconductor Parts
  • Automatic Double Sides Precision Lapping Polishing Machine for Semiconductor Parts

Automatic Double Sides Precision Lapping Polishing Machine for Semiconductor Parts

After-sales Service: 1 Year
Warranty: 1 Year
Type: Surface Grinding Machine
Samples:
US$ 1000/Piece 1 Piece(Min.Order)
| Order Sample
Customization:
Shipping Cost:

Estimated freight per unit.

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Payment Method: visa mastercard discover JCB diners club american express T/T
  Initial Payment Full Payment
Currency: US$
Return&refunds: You can apply for a refund up to 30 days after receipt of the products.
From payment to delivery, we protect your trading.
Automatic Double Sides Precision Lapping Polishing Machine for Semiconductor Parts pictures & photos
Automatic Double Sides Precision Lapping Polishing Machine for Semiconductor Parts
US $20,000-45,000 / Piece
Min. Order: 1 Piece
Gold Member Since 2011

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Secured Trading Service
Manufacturer/Factory & Trading Company
  • Overview
  • Product Description
  • Detailed Photos
  • Product Parameters
  • Features
  • FAQ
Overview

Basic Info.

Processing Object
Gear
Abrasives
Grinding Wheel
Controlling Mode
CNC
Automatic Grade
Automatic
Cylindrical Grinder Type
Universal Cylindrical Grinder
Precision
High Precision
Condition
New
Planetary Gear Specifications
Dp=12 Z=200
Number of Planetary Wheels N
3≤n≤5
Maximum Size of Workpiece (mm)
360
Minimum Thickness of Workpiece
0.4
Precision of Workpiece (mm)
0.006
Surface Roughness of Workpiece
Less Than Ra0.15μm
Dimensions(mm)
2050×1500×2700
Total Weight(Kg)
4500
Transport Package
Wooden Cage
Origin
China

Product Description

Product Description

This machine tool is mainly used for double-sided grinding and polishing of metal parts such as valve plates, valve plates, friction plates, rigid seal rings, cylinder piston rings, oil pump blades, etc.; it can also be used for silicon, germanium, quartz crystal, glass, ceramics, sapphire, Double-sided grinding and polishing of thin non-metallic hard and brittle materials such as gallium arsenide and lithium niobate.
Automatic Double Sides Precision Lapping Polishing Machine for Semiconductor Parts

Detailed Photos
Automatic Double Sides Precision Lapping Polishing Machine for Semiconductor Parts
Automatic Double Sides Precision Lapping Polishing Machine for Semiconductor Parts

Automatic Double Sides Precision Lapping Polishing Machine for Semiconductor Parts

Product Parameters
No Parameter Data
1 Grinding disc size φ1148xφ355x45/50
2 Planetary gear specifications DP=12  Z=200
3 Number of planetary wheels n 3≤n≤5
4 Maximum size of workpiece (mm) 360
5 Minimum thickness of workpiece 0.4
6 Precision of workpiece (mm) 0.006
7 Workpiece thickness accuracy (mm) 0.01
8 Surface roughness of workpiece Less than Ra0.15μm
9 Rotating Speed of Lower Grinding Disc (rpm) 10-60
  Rotating Speed of Upper Grinding Disc (rpm) 3-16
10 Sun wheel speed (rpm) 3-30
11 Dimensions(mm) 2050×1500×2700
12 Total Weight(kg) 4500
Features

(1) The machine is controlled by four motors. The upper plate, the lower plate, the sun gear and the inner gear ring are all driven by independent decelerating motors. The control is flexible and the process range is wide.
(2) The inner gear ring realizes precise lifting and automatic adjustment through the ball screw pair;
(3) The system adopts full closed loop control, multiple sensor feedback, real-time monitoring and adjustment of processing parameters;
(4) Automatic detection, feedback and compensation of processing pressure, and digital input of pressure parameters;
 

FAQ

1. Q: What is the power supply of the machine?
A: The standard power supply in china is 380V, 3P, 50Hz. We also can customized accordingly.

2. Q: What information should the customer provide to get an accurate quotation from us?
A: The customer should provide the related technical requirements, drawings, pictures, industrial voltage, planned output, etc

3. Q: What is the payment term A: The payment term is 30% down payment, and 70% before shipment(T/T mode), we also accept other payment term, like L/C, DA, D/P etc

4. Q: What is the delivery time?
A: Normally the delivery time of the machine is 30 days after receive down payment.

5. Q: What is the warrantee period of the machine?
A: The warrantee period is one year since the date of B/L.

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From payment to delivery, we protect your trading.
Automatic Double Sides Precision Lapping Polishing Machine for Semiconductor Parts pictures & photos
Automatic Double Sides Precision Lapping Polishing Machine for Semiconductor Parts
US $20,000-45,000 / Piece
Min. Order: 1 Piece
Gold Member Since 2011

Suppliers with verified business licenses

Secured Trading Service
Manufacturer/Factory & Trading Company
Number of Employees
16
Year of Establishment
2011-03-04